BGA Underfill

Product Details
Product Overview
Model 806 Low Viscosity One-Component Epoxy Structural Adhesive is a solvent-free one-component epoxy resin. It features a low linear expansion coefficient, high temperature resistance, impact resistance, vibration resistance, high bonding strength and high hardness. As a general-purpose rigid one-component epoxy adhesive, it is widely used for bonding and fixing various electronic components, electrical appliances, electromechanical hardware, magnetic components, optoelectronic products and auto parts. It offers outstanding bonding performance for encapsulation of metals, ceramics, glass, fiber products and hard plastics, and is recommended for gap filling reinforcement and chip underfill protection.
Product Parameters
Model: 806
Color: Black
Viscosity: 1000~2000
Curing Condition: 130℃, 5~10min
Hardness (Shore D): 75~80
Operating Temperature: -40~200℃
Tensile Strength (Aluminum-Aluminum): ≥6MPa
Shear Strength (Aluminum-Aluminum): ≥6MPa
Packaging Specification: 50ML per cartridge
Product Features
One-component heat curing, no mixing required, easy operation.
Low viscosity with good fluidity, suitable for filling tiny gaps.
Low linear expansion coefficient, high temperature resistance and stable long-term performance.
High hardness after curing, excellent bonding strength with moderate toughness.
Impact and vibration resistant, effectively buffer stress impact.
Excellent adhesion to multiple substrates including metal, ceramic, hard plastic and glass.
Application Scope
Developed for electronic products and industrial assembly. It achieves structural bonding and reinforcement bonding via thermal curing. Suitable for wire fixing, partial potting, BGA underfill, inductance coil and magnetic core reinforcement in electronic products. Widely used for bonding and fixing electronic components, electrical appliances, magnetic components, optoelectronic parts and auto parts.